Optimal Three-Dimensional Placement of Heat Generating Electronic Components
نویسندگان
چکیده
This work introduces an algorithm that uses simulated annealing to perform electronic component layout while incorporating constraints' related to thermal performance. A hierarchical heat transfer analysis is developed which is used in conjunction with the simulated annealing algorithm to produce final layout configurations that are densely packed and operate within specified temperature ranges. Examples of threedimensional component placement test cases are presented including an application to embedded wearable computers.
منابع مشابه
Optimization of electronic devices placement on printed circuit board
Power densities generated in today’s electronic components arise very quickly. Optimal placement of the devices on the board plays very important role for dissipation of power to the ambience. Each electronic component, as a heat source, thermally interacts with other ones. Forced convection is still one of the most important ways of heat dissipating from electronic components. When fluid moves...
متن کاملThe Optimal Design of Heat Sinks: A Review
Heat sinks are used in industrial equipment to dissipate the excess heat from their heat-generating parts to the ambient. In the last few years, efforts on manufacturing electronic or mechanical devices with less weight, space, and lower cost were spent. Heat dissipation from the heat sink is stalling a big problem which many researchers are trying to solve. The aim of this study is to brief th...
متن کاملA MULTISTAGE EXPANSION PLANNING METHOD FOR OPTIMAL SUBSTATION PLACEMENT
Optimal distribution substation placement is one of the major components of optimal distribution system planning projects. In this paper optimal substation placement problem is solved using Imperialist Competitive Algorithm (ICA) as a new developed heuristic optimization algorithm. This procedure gives the optimal size, site and installation time of medium voltage substation, using their relate...
متن کاملDetermination of Thermal Resistance in Three-Dimensional Analysis of Micro-Channel Heat Sink with Non - Newtonian Fluids
Micro-Channel Heat Sink is a heat exchanger which is used to control the temperature of electronic devices with high heat flux. A comprehensive thermal model for the micro-channels should include three dimensional conduction analysis in the solid body together with three dimensional developing fluid flow as well as heat transfer analyses in the fluid section. This paper reports on a research ...
متن کاملDetermination of Thermal Resistance in Three-Dimensional Analysis of Micro-Channel Heat Sink with Non - Newtonian Fluids
Micro-Channel Heat Sink is a heat exchanger which is used to control the temperature of electronic devices with high heat flux. A comprehensive thermal model for the micro-channels should include three dimensional conduction analysis in the solid body together with three dimensional developing fluid flow as well as heat transfer analyses in the fluid section. This paper reports on a research ...
متن کامل